"TMP19A64F20AXBG, our second product based on Toshiba NANO FLASH technology, integrates 2MB of NANO FLASH memory, the largest memory capacity currently available in the industry. This high-density embedded memory is a significant technical milestone that enables the control of large programs with a single chip," said Roland Gehrmann, business development manager in the ASSP Business Unit at TAEC.

The TMP19A64F20AXBG integrates the Toshiba TX19A core with its excellent code efficiency and interrupt responsiveness, 2MB of NANO FLASH memory and 64 kilobytes of random-access memory (RAM). A new backup mode function achieves reduced power consumption by suppressing current leakage even when in standby mode. In backup mode, power consumption is only a very low 5 microamperes at 2.7 volts. The backup mode function also supports the real-time clock and a small amount of RAM. Other built-in functions include a 24-channel by 10-bit high-speed analog-to-digital converter with a conversion speed of 8.44 microseconds and an 8-channel high-speed serial interface. The device features an extremely fast multiply/accumulate (MAC) capability of 32 bit by 32 bit plus 64 bit in a single clock cycle.

About Toshiba NANO FLASH Technology

Toshiba NANO FLASH is a new technology for embedded flash MCUs that combines the best attributes of a NAND flash cell and a NOR peripheral circuit to create high-density embedded memory with ultra-low power consumption. Embedded NOR flash technologies generally require substantially more power than the corresponding mask ROM technology. Since battery life is affected by the current consumption of the device, this power drain prevents effective use of NOR flash technology as a new-product launch vehicle or to replace mask ROM with the NOR flash equivalent in production. To meet these application needs, Toshiba Corporation developed NANO FLASH technology.

NANO FLASH technology uses a NOR architecture with memory cells connected in parallel to bit-lanes to achieve the high-speed random access required for embedded program memory. It employs NAND flash cell technology with Fowler- Nordheim (FN) tunneling for both program and erase to provide very fast program and erase times with ultra-low power consumption. In addition, Toshiba improved the readout circuit and its timing control which diminished DC current dissipation and allowed low-power consumption. Finally, the process was changed from a memory process to a logic process in order to embed the flash memory cells with high-performance CMOS technology.

Pricing and Availability

Samples of the TMP19A64F20AXBG NANO FLASH MCU are available now and the device is in volume production. Pricing of TMP19A64F20AXBG is $27.00 in 10,000-piece quantities.

A mask ROM version, TMP19A64C1DXBG, is also available with sample shipments planned to start this month. Pricing of TMP19A64C1DXBG is expected to be $18.00 in 10,000-piece quantities. Mass production is expected to begin in June 2006. The combined production volume of the NANO FLASH and mask ROM versions is expected to total 500,000 pieces per month.

    For a product brief, please visit:
www.toshiba.com/taec/components/docs/ProdBrief/06C07_TMP19A64_ProdBrief.pdf

*About TAEC

Combining quality and flexibility with design engineering expertise, TAEC brings a breadth of advanced, next-generation technologies to its customers. This broad offering includes memory and flash memory-based storage solutions, a broad range of discrete devices, displays, medical tubes, ASICs, custom SOCs, microprocessors, microcontrollers and wireless components for the computing, wireless, networking, automotive and digital consumer markets.

TAEC is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corp. (Toshiba), Japan's second largest semiconductor manufacturer and the world's ninth largest integrated manufacturer of electric and electronic equipment. In almost 130 years of operation, Toshiba has recorded numerous firsts and made many valuable contributions to technology and society. For additional company and product information, please visit TAEC's website at chips.toshiba.com. For technical inquiries, please e-mail Email Contact.

Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications. In developing designs, please ensure that Toshiba products are used within specified operating ranges as set forth in the most recent Toshiba product specifications and the information set forth in Toshiba's "Handling Guide for Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This information is available at www.chips.toshiba.com, or from your TAEC representative.

All trademarks and tradenames used herein are the properties of their respective holders.

CONTACT: Agency, Judy Kahn, +1-650-948-8881, Email Contact

Web site: http://www.toshiba.com/taec/
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